Description
Dicing Machine (to saw silicon/glass substrates)Configuration
No ConfigurationOEM Model Description
Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces High processability Adoption of a 1.8 kW high-output spindle enables the processing of a wide range of materials from silicon to difficult-to-process materials like ceramics. High maintainability Built-in microscope with a lens shutter and scope blow function reduces maintenance frequency, which increases the utilization rate.Documents
No documents
DISCO
DAD3240
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 12 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116029
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DAD3240
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 12 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116029
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Dicing Machine (to saw silicon/glass substrates)Configuration
No ConfigurationOEM Model Description
Simple and Compact Manual Dicing Saw Compatible with Φ8-inch Workpieces High processability Adoption of a 1.8 kW high-output spindle enables the processing of a wide range of materials from silicon to difficult-to-process materials like ceramics. High maintainability Built-in microscope with a lens shutter and scope blow function reduces maintenance frequency, which increases the utilization rate.Documents
No documents