Overview

The Tilting Spindle dicing system is designed to meet the needs of Optoelectronic component manufacturers by providing both perpendicular cuts and 8 angular cuts needed to suppress back-reflection in fiber optic components. The 71TS has the same machine specification as 7122 with 0.1angular repeatability and resolution. The system has dedicated programmable work stations for both angular settings. It is quick changeover from perpendicular (0) to any angle up to 15. The 71TS permits angular dicing of Planar Wave Guides such as: Silicon, Silica-on Silicon, Polymers on Si, InP, GaAs, Fiber Wave Guides, LiNbO3, Fused Silica.