Description
No descriptionConfiguration
Load lock: function normal CHE/CHF (TC type) no laser gun, CCD PCB, ORIENT PCB CHA/B function normal CH-1 CH2 (wide body) standard heater, G12 magnet function normal CH-3 CH-4 Buffer function normal XFER (VHP robot) function normal Main AC rack System rack function normal System rack function normal RF rack COMET GEN*1 , ENNER STREAM S*3, AE PINNACLE*1 Compressor, Neslab function normalOEM Model Description
AMAT leveraged its expertise in single-wafer, multichamber architecture to develop an evolutionary platform called the Endura 5500 PVD (physical vapor deposition) in 1990 featuring a staged, ultra-high vacuum architecture for the rapid sputtering of aluminum and other metal films used to form the circuit interconnections on advanced devices.Documents
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APPLIED MATERIALS (AMAT)
ENDURA 5500
Verified
CATEGORY
PVD / Sputtering
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
107897
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
ENDURA 5500
CATEGORY
PVD / Sputtering
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
107897
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Load lock: function normal CHE/CHF (TC type) no laser gun, CCD PCB, ORIENT PCB CHA/B function normal CH-1 CH2 (wide body) standard heater, G12 magnet function normal CH-3 CH-4 Buffer function normal XFER (VHP robot) function normal Main AC rack System rack function normal System rack function normal RF rack COMET GEN*1 , ENNER STREAM S*3, AE PINNACLE*1 Compressor, Neslab function normalOEM Model Description
AMAT leveraged its expertise in single-wafer, multichamber architecture to develop an evolutionary platform called the Endura 5500 PVD (physical vapor deposition) in 1990 featuring a staged, ultra-high vacuum architecture for the rapid sputtering of aluminum and other metal films used to form the circuit interconnections on advanced devices.Documents
No documents