Description
No descriptionConfiguration
Load lock: function normal CHE/CHF (TC type) no laser gun, CCD PCB, ORIENT PCB CHA/B function normal CH-1 CH2 (wide body) standard heater, G12 magnet function normal CH-3 CH-4 Buffer function normal XFER (VHP robot) function normal Main AC rack System rack function normal System rack function normal RF rack COMET GEN*1 , ENNER STREAM S*3, AE PINNACLE*1 Compressor, Neslab function normalOEM Model Description
AMAT leveraged its expertise in single-wafer, multichamber architecture to develop an evolutionary platform called the Endura 5500 PVD (physical vapor deposition) in 1990 featuring a staged, ultra-high vacuum architecture for the rapid sputtering of aluminum and other metal films used to form the circuit interconnections on advanced devices.Documents
No documents
APPLIED MATERIALS (AMAT)
ENDURA 5500
Verified
CATEGORY
PVD / Sputtering
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
107897
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
ENDURA 5500
CATEGORY
PVD / Sputtering
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
107897
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Load lock: function normal CHE/CHF (TC type) no laser gun, CCD PCB, ORIENT PCB CHA/B function normal CH-1 CH2 (wide body) standard heater, G12 magnet function normal CH-3 CH-4 Buffer function normal XFER (VHP robot) function normal Main AC rack System rack function normal System rack function normal RF rack COMET GEN*1 , ENNER STREAM S*3, AE PINNACLE*1 Compressor, Neslab function normalOEM Model Description
AMAT leveraged its expertise in single-wafer, multichamber architecture to develop an evolutionary platform called the Endura 5500 PVD (physical vapor deposition) in 1990 featuring a staged, ultra-high vacuum architecture for the rapid sputtering of aluminum and other metal films used to form the circuit interconnections on advanced devices.Documents
No documents