ENDURA SL PVD
Category
PVD / SputteringOverview
Applied Materials, Inc.SL has been introduced, a new generation of Applied Materials, Inc.PVD (physical vapor deposition) platform. The new platform features high throughput and productivity in several PVD applications and expands the family of products to provide customers with a complete offering of PVD solutions. The system, which is available with several PVD aluminum and barrier layer process chambers, uses two dual-blade robots for faster wafer handling and higher transfer speeds. The system's new loadlock module accommodates the degas and cooldown chambers, enabling up to six process chamber positions on the platform for maximum system capacity and overall throughput. The system is designed to conform to the latest communications and facility standards, and is available with factory automation capability.
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