Overview

ENDURA® ALPS® PVD (ALPS CO & NI) The Applied Endura ALPS (Advanced Low-Pressure Source) Cobalt PVD (Physical Vapor Deposition) system offers a simple, high-performance silicide solution for gate and contact applications in high aspect ratio structures. Extending cobalt to ≤90nm technology nodes, ALPS technology produces good Co bottom coverage with no plasma damage to the device and very low defect counts. Endura ALPS Co addresses the challenges of titanium agglomeration, contact resistance change, and dopant suction through excellent resistivity, low leakage current, and thermal stability.