IP-300H
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ProbersOverview
Feature: Application for wafer size : 8”~12” Contact accuracy : ±1㎛ (Advanced motion control technology) Improvement of loading accuracy (Wafer change and align time reduction) Stiffness Z-axis (250 kgf) Application of auto leveling / securing the stability of contact (10㎛) Auto card change (Side auto card change)
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