Overview

A next-generation system for transistor-level backside analysis of complex IC designs with both flip-chip and wire bond packaging technologies. Featuring a new Solid Immersioin Lens (SIL), EmiScope-II provides an industry-leading sub-0.25 micron image resolution and enhanced data acquisition rate to enable analysis of device performance at the critical node level. The system’s high-speed acquisition and data processing capabilities enable semiconductor manufacturers to quickly perform design debug, failure analysis and characterization, improving time-to-market and lowering device development costs.