Overview

The PD-220NL is a loadlock plasma-enhanced chemical vapor deposition (PECVD) system capable of depositing silicon-based films (silicon oxide, silicon nitride, silicon oxynitride and amorphous silicon). This system offers all of the standard features for PECVD in a very compact footprint. Films with superior thickness uniformity and stress control can be deposited over a 220 mm diameter area with excellent stability and repeatability. This system is ideal for depositing thin films for R&D as well as for pilot production.