Description
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· One Machine with 2 Process Modules and one Square LoadLock in between, · Left Chamber: PECVD (No turbo). · Right Chamber ICP/RIE (with Turbo) and ENDPOINT DETECTOR(LASER),1 Quartz Clamp 6" · LoadLock- Square with rotating arm · PC Computer with Oxford Software Version-PC2000 · All Mechanical Pumps are Oil pump. (3 Pumps) · One Chiller attached to ICP/RIE · 2 Gas Pods: PECVD- SiH4 (silane) N2O NH3 (ammonia) ICP/RIE- C4F8 O2 HeOEM Model Description
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesDocuments
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OXFORD
PLASMALAB 100
Verified
CATEGORY
PECVD
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116992
Wafer Sizes:
Unknown
Vintage:
Unknown
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OXFORD
PLASMALAB 100
CATEGORY
PECVD
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116992
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
· One Machine with 2 Process Modules and one Square LoadLock in between, · Left Chamber: PECVD (No turbo). · Right Chamber ICP/RIE (with Turbo) and ENDPOINT DETECTOR(LASER),1 Quartz Clamp 6" · LoadLock- Square with rotating arm · PC Computer with Oxford Software Version-PC2000 · All Mechanical Pumps are Oil pump. (3 Pumps) · One Chiller attached to ICP/RIE · 2 Gas Pods: PECVD- SiH4 (silane) N2O NH3 (ammonia) ICP/RIE- C4F8 O2 HeOEM Model Description
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesDocuments
No documents