Used BESI / ESEC Equipment for Sale | Moov

Something went wrong. Try refreshing the page, and contact support@moov.co if the problem persists.

Skip to main content

We value your privacy

We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. Read More

Messages

VIEW ALL MESSAGES

Messages

listing-image-

Messages including contact info may not be shared. We scan, review, and reserve the right to remove sensitive information from all messages to prevent fraud and policy violations.All messages subject to review, review our policy for more info.

Marketplace > Parts > BESI / ESEC

Manufacturer

BESI / ESEC

Overview

BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations. Founded in 1968, Esec is a leading global manufacturer of die bonding equipment for the semiconductor, telecommunications and smart card industries based in Cham, Switzerland. It also manufactures and services wire bonding systems from its Singapore assembly facility.

Active Listings

6

Total Products

2

Services

Inspection, Insurance, Appraisal, Logistics

Top BESI / ESEC Parts

Sell your equipment with Moov!

List it with Moov and find the perfect buyer in no time at all.

All BESI / ESEC Parts

See All Listings

B

B