Overview

The RAD-2000 F/8 state-of-the-art fully-automatic UV irradiation system, meticulously designed for the precise curing of UV type dicing tape. This cutting-edge system is specifically tailored to cater to ring frame sizes utilized in the manufacturing processes of 150mm and 200mm wafers. With its advanced technology and user-friendly interface, it ensures optimal efficiency and accuracy in the UV curing process, making it an indispensable tool for your semiconductor manufacturing needs. Say goodbye to manual labor and embrace the future of UV tape curing with our exceptional UV irradiation system.