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Marketplace > Packaging > BESI / FICO > AMS-LM Top Foil

AMS-LM Top Foil

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Packaging
Overview

In line with the market trend of larger substrates, Besi Netherlands has introduced a new large substrate molding machine with Top Foil functionality, to mold single sided MAP products like BGA, QFN and BOC. The unique Top Foil feature on this machine allows bleed free production of bare die products. Top Foil: A special foil, guided over the top mold, creates a soft sealing layer between mold and products. As a result, the die stays clear of compound. The use of top foil eliminates an extra cleaning process step after molding. The Fico AMS-LM Top Foil can handle substrates of up to 102 x 280 mm and can handle all current single sided packages.

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