The Fico Compact Line (FCL) Trim & Form line, is an ultra-flexible platform for leadframe based discretes, ICs, Mems and power packages. The FCL is developed for a frame width of 100 mm so it can handle any newly designed high density leadframe. Its unique wheel transport in combination with horizontal offloading makes the FCL suited for any kind of leadframe.

Besi Netherlands B.V. develops and manufactures machines for the semiconductor industry under the brand name Fico. This includes molding systems, trim & form equipment, laser markers, and singulation systems for leadframe and array connect substrates.

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