Designs, manufactures and services ion implantation and other processing equipment used in the fabrication of semiconductor chips.

200mm high tilt and medium current applications for all chips.

AXCELIS

NV 8250HT

Axcelis Technologies' 8250 medium current line uses an ultra-pure, parallel beam design enhanced by extremely precise wafer positioning, enabling the minute detailing of transistors. The 8250 provides the advanced process capabilities necessary for medium current implants. Incorporating several key productivity enhancements in its design, it offers enhanced yield and serial processing advantages. This system is a fully automated, 200mm, serial processing system designed to maximize productivity and minimize all forms of contamination. Production-proven beam optics and wafer position control deliver pure, parallel and repeatable beams. The 8250 is the industry's only medium current system to incorporate a final energy filter, ensuring maximum beam purity over the entire energy range of multiply-charged species up to 750keV. New features such as the extended life source (ELS), electrostatic chuck, fully integrated statistical process control (SPC), and slit load lock process chamber allow the 8250 to provide superior processing capability at the lowest cost of ownership.

NV 8250

NV 6200

Purion M medium current ion implant system. This system offer industry leading purity, precision and productivity through enhanced single magnet scanned spot beam architecture at a higher productivity (500 wafer per hour throughput) and lower cost of ownership than competitive offerings, in addition to other advantages.

PURION M

NV 6200A

NV-MC3 300mm high tilt and medium current applications for all chips.

AXCELIS

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NV 8250HT

NV 8250

NV 6200

PURION M

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