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EVGroup (EVG) IQ ALIGNER
  • EVGroup (EVG) IQ ALIGNER
  • EVGroup (EVG) IQ ALIGNER
  • EVGroup (EVG) IQ ALIGNER
Description
Lithography Lithography Machine
Configuration
No Configuration
OEM Model Description
"The IQ Aligner allows for imprint processes with stamps and wafers from 150 mm to 300 mm diameter. The tool’s configuration for nanotechnology applications can include stamp release mechanisms and programmable contact force capability. A temperature controlled chuck for large substrates provides unmatched stamp to substrate overlay accuracy. Uniform contact force for high yield large area printing is provided by EVG's proprietary chuck design which supports both soft and hard stamps. The IQ Aligner can be used for micromolding processes for the fabrication of optical elements."
Documents

No documents

CATEGORY
Mask/Bond Aligners

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

115769


Wafer Sizes:

8"/200mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

EVGroup (EVG)

IQ ALIGNER

verified-listing-icon
Verified
CATEGORY
Mask/Bond Aligners
Last Verified: Over 60 days ago
listing-photo-b4632eeea07b4e55b1e048e93e2fed4c-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

115769


Wafer Sizes:

8"/200mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Lithography Lithography Machine
Configuration
No Configuration
OEM Model Description
"The IQ Aligner allows for imprint processes with stamps and wafers from 150 mm to 300 mm diameter. The tool’s configuration for nanotechnology applications can include stamp release mechanisms and programmable contact force capability. A temperature controlled chuck for large substrates provides unmatched stamp to substrate overlay accuracy. Uniform contact force for high yield large area printing is provided by EVG's proprietary chuck design which supports both soft and hard stamps. The IQ Aligner can be used for micromolding processes for the fabrication of optical elements."
Documents

No documents