We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. Read More
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. Read More
-Green laser -Drilling, marking, structuring and ablation of free forms -Substrate thickness from 0.3mm to 50.0mm -Exactly right-angled machining -Chamfering possible during the drilling process -High yield with high accuracy -Space-saving stand-alone unit with simple user interface -integrated suction
1
Inspection, Insurance, Appraisal, Logistics