Just click on the layout files instead of manufacturing expensive tools – that’s how easy the LPKF MicroLine 2000 Ci  can be employed to process different products. Users enjoy cutting edge competitive advantages thanks to the very high quality and flexible production planning. The MicroLine 2000 Ci systems are remarkably compact, easy to operate, with a very good price performance ratio – a welcome addition to the electronic production team. The choice of available laser sources for the MicroLine 2000 platform has been expanded by a high power option for increased cutting performance.

MicroLine 2000 Ci systems feature multiple variations: MicroLine 2110 Ci (10 Watt laser source),  MicroLine 2115 Ci (15 Watt laser source), MicroLine 2127 Ci (27 Watt laser source) and MicroLine  2236 Ci (36 Watt laser source).

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MicroLine 2115 Ci

AMP 3000

LIDE M5000 Gen2

Protolaser R4

MicroLine 2820CI	

606320 P

MicroLine 2820P

Glass wafer thickness: 0.3 to 3 mm
Bridge tool: 150/200 mm wafer or 200/300 mm wafer
EFEM: Two standard FOUPs
Compatible with flat/notch wafers
SECS/GEM for simple integration and configuration
SEMI E84
System dimensions (W x H x D): 1800 x 2200 x 3000 mm

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Protolaser R4

LIDE M5000 Gen2

AMP 3000

MicroLine 2115 Ci

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