ILC 3000
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LaserOverview
Introducing IL 3000, the cutting-edge solution for unpolished 300mm wafers with deep marking capabilities. Experience seamless automatic handling and precise alignment of the wafers. With up to four cassette stations, it maximizes efficiency. Additionally, IL 3000 offers a range of optional features, providing a customizable and versatile solution to meet your specific needs. Simplify your wafer processing with IL 3000.
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