Overview

Combining a state-of-the-art laser optic module with 3D-Micromac’s highly modular semiconductor wafer dicing platform, the microPRO™ XS provides laser annealing with high repeatability and high throughput. The system features a UV-wavelength diode-pumped solid-state (DPSS) laser source with nano-second pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat-related damage to the front-side of the wafer—making it ideally suited for OCF in SiC power devices.