The completely revised table top die bonding platform can be easily configured for a wide range of applications for process development or prototyping. Numerous process module options and in-field-retrofit capabilities guarantee maximum technological flexibility of the table top die bonder to protect your investment in the face of ever-changing challenges. Due to the table top flip chip bonder’s ergonomic machine design and software-supported user guidance, the user remains at the center of action. Powerful optical systems allow the user to keep an overview at all times, even when working in the sub-micron range. The table top die bonder FINEPLACER® lambda shares a common module range and innovative operating software with Finetech's automatic die bonding systems to ensure a seamless process migration to series production.
Features:
 Sub-micron placement accuracy
 Superior optical resolution
 Excellent price performance ratio
 Individual configurations with process modules
 Numerous bonding technologies (adhesive, soldering)
 Data/media logging and reporting function
 Wide range of controlled bonding forces
 Full process access & easy visual programming with touch screen interface
 Various bonding technologies in one recipe
 Process module compatibility across Finetech platforms
 In-situ process observation in HD
 Modular machine platform allows in-field retrofitting during entire service life
 Synchronized control of all process related parameters Overlay vision alignment system (VAS) with fixed beam splitter
 Sequence control with predefined parameters

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FINETECH INC

FINEPLACER lambda 96

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FINETECH INC

FINEPLACER lambda 96

Flip Chip Bonders

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FINEPLACER lambda 96

Flip Chip Bonders

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