8800 FC QUANTUM
Category
Flip Chip BondersOverview
The Datacon 8800 FC Quantum is a state-of-the-art flip chip platform designed to meet the challenges of modern flip chip production and future demands, offering user-friendly operation. This dedicated flip chip system provides a high-volume production solution with a perfect balance of precision and flexibility. With its advanced design, the 8800 FC Quantum can achieve an impressive throughput of up to 10,000 units per hour (UPH) without compromising process stability and reliability. FlipChip Bonder
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BESI / DATACON
8800 FC QUANTUM
Flip Chip BondersVintage: Condition: UsedLast Verified13 days agoBESI / DATACON
8800 FC QUANTUM
Flip Chip BondersVintage: Condition: UsedLast Verified13 days agoBESI / DATACON
8800 FC QUANTUM
Flip Chip BondersVintage: Condition: UsedLast VerifiedOver 30 days agoBESI / DATACON
8800 FC QUANTUM
Flip Chip BondersVintage: Condition: UsedLast VerifiedOver 60 days ago