NOVA
Category
Flip Chip BondersOverview
The ASMPT AMICRA NOVA is a precision die-bonding and flip-chip bonding platform for semiconductor assembly.
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Inspection, Insurance, Appraisal, Logistics
The ASMPT AMICRA NOVA is a precision die-bonding and flip-chip bonding platform for semiconductor assembly.
1
Inspection, Insurance, Appraisal, Logistics