Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits.

The Windows 2000-based ATX2, introduced in fiscal 1999, includes a high current feature to allow the system to burn-in more devices, plus an extended pattern generation capability. 

AEHR TEST SYSTEMS

ATX2

Full Wafer Test System. Compact Test and Reliability Verification Solution for Logic/Memory/Photonic Devices

FOX-CP

Full Wafer Test System. High Power Test and Reliability Verification Solution for Logic / Memory / Photonic Devices.

FOX-1P

The ATX3 system, introduced in 2002, is targeted at devices which require greater voltage accuracy and lower voltages.

ATX3

Multi Wafer & Singulated Die / Module Test System. High Throughput Burn-in and Test Solution for Logic/Memory/Photonic/Power Devices.

FOX-XP

For burning-in and testing DUTs such as microprocessors, DSPs, and logic devices, which require low voltage.
The MAX3 system features multi-tasking Windows 2000-based software which includes lot tracking and reporting software that are needed for production and military applications. The MAX3 system, introduced in fiscal 1999, has 96 channels, and handles the latest low voltage ICs.  The MAX3 also has extended stored test program capability for more complete exercise and output monitoring of complex logic devices such as digital signal processors.  The output monitor feature allows the MAX3 to perform functional tests of devices and it also supports built-in self-test ("BIST") or other scan features.

MAX3

The ATX system is designed for dynamic and monitored burn-in of high pin- count logic devices, including microprocessors, microcontrollers, application-specific ICs ("ASICs"), and certain memory devices.  The ATX
system uses much of the same software as the MAX system.  Its 256-channel pin electronics configuration allows it to handle complex logic devices, and its ability to burn-in different device types in each of the system's 32 BIB positions is useful for quality assurance applications.

The Advanced Burn-In and Test System (ABTS) solution provides flexibility for the test / burn-in of packaged semiconductor devices.

ABTS

The MAX4 system was introduced in 2001.  Like the MAX3, it offers 96 channels and output monitoring; however, the MAX4 further extends the capabilities of the MAX3.  The MAX4 is targeted at devices which require better voltage accuracy and higher current.  It can provide up to 227 amps of current per BIB position.

MAX4

The MTX massively parallel test system is designed to reduce the cost of memory testing by processing thousands of memory devices simultaneously, including DRAMs, flash memories, SDRAMs, DDR SDRAMs, DDR II SDRAMs, and SRAMs. The MTX system can perform a significant number of tests usually performed by traditional memory testers, including pattern sensitivity tests, functional tests, data retention tests and refresh tests.

The MAX5 and ABTS are the industry’s most capable test and burn-in platform for today’s advanced semiconductor devices.

MAX5

The production version of the MAX2 system holds 64 burn-in boards ("BIBs"), each of which may hold up to 350 or more devices, resulting in a system capacity of up to 22,400 or more devices.

MAX2

The FOX-1 full wafer parallel test system, introduced in June 2005, is designed for massively parallel test.  The FOX-1 system is designed to make electrical contact and test all of the die on a wafer at once.  The Company
believes that this can significantly reduce the cost of testing IC wafers.

FOX-1

The FOX-14 full wafer contact burn-in and parallel test system, introduced in July 2001, is designed to make contact with all pads of a wafer simultaneously, thus enabling full wafer burn-in and parallel test of up to 14
IC wafers at a time. One of the key features of the FOX system is the patented WaferPak cartridge system.  This unique design is intended to accommodate a wide range of contactor technologies. Wafer-level burn-in and
test enables lower cost production of Known-Good Die ("KGD") for multichip modules and systems-in-a-package.


FOX-14

Full Wafer & Singulated Die / Module Test System. Compact High Power Test and Reliability Verifications Solution for Logic/Memory/Photonic/Power Devices.

FOX-NP

The MAX system is designed for dynamic burn-in of memory and logic devices.

AEHR TEST SYSTEMS

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FOX-NP

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