TEL / TOKYO ELECTRON

SCCM TE

TSP-30555SSS

SCCM

SDRM

Gas Cluster Ion Beam system

TEL’s UltraTrimmer series provides precise control of film thickness by reducing surface roughness. Cutting edge technology enables industry leading performance: sub-nanometer thickness control, a wide range of dynamic correction and high-throughput processing. UltraTrimmer series realizes a variety of custom process profiles for silicon or compound substrate and contributes to yield improvement and performance enhancement.

ULTRATRIMMER 30

DRM+

UNITY II 855 PP

UltraTrimmer Plus brings unique trimming technology for 100/150/200mm wafer with industry leading corrective etch capabilities and best in class cost of ownership. To provide higher yield manufacturing, UltraTrimmer Plus™ proposes the most effective solution to reduce various material properties.

UltraTrimmer Plus

SP 3055DD DRM

308 SCCM

SCCM SHIN

TEL / TOKYO ELECTRON

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Top TEL / TOKYO ELECTRON Etch/Asher

SCCM TE

960

SDRM

SCCM

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