Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

The Endura Electra Cu™ System is a production-proven solution for copper interconnect metallization. It utilizes IMP-based technologies in a revolutionary process sequence to deposit a barrier layer of tantalum (Ta) or tantalum nitride (TaN), followed by a thin seed layer of copper in an IMP Cu chamber. This provides the critical base needed for successful subsequent bulk copper fill. The Endura Electra Cu system is currently being used by industry leaders and is the first-production capable system of its kind.

APPLIED MATERIALS (AMAT)

ENDURA ELECTRA Cu

PVD / Sputtering

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ENDURA ELECTRA Cu

PVD / Sputtering

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