Overview

This Reactive Ion Etch (RIE) system etches materials such as silicon nitride, silicon oxide, GaN, and chromium, along with photoresist and various organic materials. The TRION Minilock Phantom contains Inductively Coupled Plasma (ICP) to maximize etch speed and its vacuum lockload allows the main chamber to remain pumping while loading or unloading sample for efficiency. Configuration includes 4 gas channels, 4 tylan mass flow controllers, advanced energy RFX-600 RF generator, corrosion resistant turbomolecular pump with controller, dry pump, and vacuum gauge. The Minilock-Phantom RIE ICP is an advanced high density etching system with a vacuum loadlock and an Inductively Coupled Plasma source. It has been designed to provide innovative, leading edge processes. The small footprint and robust design make it ideal for both research and production environments.