Mattson Technology, Inc. designs, manufactures, markets and globally supports semiconductor wafer processing equipment used in the fabrication of integrated circuits. Supplier of plasma and rapid thermal processing (RTP) equipment to the global semiconductor industry, and operate in four primary product sectors: Dry Strip, Etch, Rapid Thermal Processing and Millisecond Anneal.

Novyka family surface treatment, interface treatment and radical enhanced thermal treatment (RETTTM) systems provide unique solutions for critical surface treatment, interface control and materials modification capabilities, including damage free surface clean, selective surface treatment, and precise materials modification.  As part of Atomic Surface EngineeringTM and Atomic Interface EngineeringTM product portfolio, Novyka family technologies address specific process integration requirements across advanced lithography, etch, clean, thin film and diffusion unit processes, and enable cutting-edge memory and logic semiconductor device scaling and specialty semiconductor device manufacturing. 

MATTSON

NOVYKA

Alpine is a cost effective, technology platform for both advanced plasma strip and semi-critical etch applications. Based on proprietary Faraday shield inductively coupled plasma (ICP) source design, Alpine incorporates an electrostatic chuck with bias capability to provide independent control of ion energy and ion density. Developed on a production proven platform, Alpine delivers superior productivity and cost of ownership.

ALPINE

SUPREMA XP

paradigmE PAD series products have benefits in high etch rate, low plasma damage and low cost of consumables, and are the only ICP PAD etchers in mass production.

paradigmE PAD

The Suprema III utilizes the advanced processing technology of the Suprema XP, while reducing both the amount of factory space required for installation and the operating cost per wafer of the new system.

SUPREMA III

paradigmE XP series products have excellent etch selectivity and low plasma damage for on-wafer devices, and are widely used for film etching in semiconductor front-end and back-end manufacturing.

paradigmE XP

The Aspen III’s exceptional platform design can handle both 200 mm and 300 mm wafers, and supports special wafer handling including warped and translucent wafers. The unique process chamber architecture can accommodate technical requirements across multiple technology nodes for the most demanding device manufacturers in the industry.

ASPEN III

MATTSON Aspen II is Etchers & Ashers system. the Aspen II can be used with 8” wafer size.
Aspen II is based on a highly reliable and productive system design. It provides proven process capabilities and cost of ownership benefits in high volume manufacturing to chipmakers worldwide.

ASPEN II

Built on the paradigm product architecture, paradigm Si incorporates enhancements to enable customers to run the chemistries required for poly-silicon applications. The system features Mattson Technology's proprietary Faraday shield designed to improve etch process control and enhance mean-time-between-clean (MTBC) performance by up to three times over competitive systems. The paradigm Si also enables true independent control of ion density and energy, providing improved profile control and minimized sputtering to reduce maintenance costs for the lowest cost-of-ownership. The paradigm Si is specifically targeted at semi-critical poly etch applications by providing excellent process performance with over 30% better cost-of ownership advantages over any competitive etch system currently on the market.

paradigm SI

The 300-mm Suprema strip system is based on a flexible, modular design that makes it ideal for both development and production environments. The system features vacuum and atmospheric robotics said to deliver increased throughput of greater than 300 wafers per hour. This represents more than a 40 percent improvement compared to competitive systems for bulk strip applications. Suprema's proprietary inductively coupled plasma source provides increased strip rates of over 9 microns/minute. Its vacuum robot utilizes a transfer mechanism, capable of transferring four wafers simultaneously, to minimize overhead time. Suprema can be configured with two dual-wafer modules.

SUPREMA

paradigmE plasma etch systems have unique capabilities to independently control ion energy and ion density.

paradigmE

PARADIGME SP

Built on the paradigmE product architecture, paradigmE Si incorporates enhancements to enable customers to run the chemistries required for poly-silicon applications. The system features Mattson Technology's proprietary Faraday shield designed to improve etch process control and enhance mean-time-between-clean (MTBC) performance by up to three times over competitive systems. The paradigmE Si also enables true independent control of ion density and energy, providing improved profile control and minimized sputtering to reduce maintenance costs for the lowest cost-of-ownership.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

MATTSON

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Top MATTSON Dry / Plasma Etch

ALPINE

paradigmE XP

SUPREMA III

SUPREMA XP

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All MATTSON Dry / Plasma Etch