Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

The AMAT CENTURA eMAX ETCH is an advanced dielectric etch system designed for fabricating semiconductor chip structures with feature sizes as small as 0.13 microns and beyond. It optimizes etching, photoresist strip, and barrier removal in a single chamber, reducing costs and cycle times. The system supports various applications, including etch, epitaxy, CVD, RTP, and plasma nitration. Its integration with existing Centura platforms allows for enhanced flexibility and adaptation to different process requirements. Introduced in June 2000, the eMAX ETCH specializes in etching a wide range of dielectric films, crucial for producing high-precision and reliable semiconductor devices in the contact and interconnect regions of chips.
The Dielectric Etch eMax Centura was introduced in June 2000 as an extension of Applied's MxP+ and Super e dielectric process chamber designs.
The Applied Centura eMax system etches a broad range of dielectric films in the contact and interconnect regions of the chip.

APPLIED MATERIALS (AMAT)

CENTURA eMAX ETCH

Dry / Plasma Etch

Similar Listings

APPLIED MATERIALS (AMAT)

CENTURA eMAX ETCH

CENTURA eMAX ETCH

Dry / Plasma Etch

Similar Listings

APPLIED MATERIALS (AMAT)

CENTURA eMAX ETCH