CENTURA AP
Category
Dry / Plasma EtchOverview
The Centura and Centura AP mainframe single-wafer, multi-chamber architectures enable integrated, sequential wafer processing in up to four process chambers for 150mm, 200mm, and 300mm wafers.
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APPLIED MATERIALS (AMAT)
CENTURA AP
Dry / Plasma EtchVintage: 2005Condition: UsedLast VerifiedOver 60 days agoAPPLIED MATERIALS (AMAT)
CENTURA AP
Dry / Plasma EtchVintage: 2006Condition: UsedLast VerifiedOver 60 days agoAPPLIED MATERIALS (AMAT)
CENTURA AP
Dry / Plasma EtchVintage: Condition: Parts ToolLast VerifiedOver 60 days agoAPPLIED MATERIALS (AMAT)
CENTURA AP
Dry / Plasma EtchVintage: Condition: UsedLast VerifiedOver 60 days ago
