Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

The Centura 5200 DPS R1 is a high-performance metal etch system introduced by Applied Materials1. It delivers high-productivity silicon, metal, and dielectric etch2. The system has two enhanced chambers: the DPS etch chamber and the ASP+ (advanced strip and passivation) module. The Centura 5200 DPS R1 system is designed for 150mm and 200mm or 8"  wafer sizes.

APPLIED MATERIALS (AMAT)

CENTURA 5200 DPS R1

Dry / Plasma Etch

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CENTURA 5200 DPS R1

Dry / Plasma Etch

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