Overview

The AW-901eR TTW Plasma/RlE etch System is a fully automated, single-wafer plasma Polysilicon Nitride etching system that processes 3″, 4″, 5″, 6″ wafers. The AW-901eR TTW system is used in one part of the sequence of manufacturing steps that transfer a pattern formed from a layer of photosensitive material, the photoresist, to a layer that makes up a permanent part of the finished device. The process of defining a pattern with photoresist is known as photolithography, while the etch process transfers the photoresist pattern to the permanent layer.