Overview

The AW-303R is an electromechanical production system used to etch materials such as nitride, oxide, polysilicon,etc. from the surface of silicon or other substrates. Each wafer is processed individually by means of a chemical reaction induced by a gas plasma.The AW-303R is an automated single wafer tool designed as a flexible 13.56MHz RF downstream plasma etch system for high-volume wafer fabrication. The AW-303R is in direct response to manufacturer’s concerns for wafer uniformity, uptime, reliability and production-proven technology.