Description
No descriptionConfiguration
Fully Refurbished. Working Condition. Can build to spec.OEM Model Description
The 2200 apm+ is a die bonder from Datacon that is designed for advanced packaging with flip chip and die attach technologies. It can handle wafers of up to 300 mm and dies of up to 50 mm. The machine has a placement accuracy of 10µm@3s, making it suitable for handling the most demanding packages, including optoelectronic components. The 2200 apm+ is also capable of handling flip chip and die attach in one module, making it a versatile and flexible solution for advanced packaging. The machine is fully integrated into Datacon’s platform concept, allowing it to be combined with other line components such as stack loaders, Epoxy Writers, or the 2200 apm die bonder. This means that customers can tailor their production lines to their specific needs. The 2200 apm+ also has a range of accessories available, including wafer mapping, dispense units, gripper indexers, offline programming, and magazine handlers. Despite its advanced capabilities, the 2200 apm+ is operator-friendly and easy to use. Training times are short and reject rates are kept to a minimum. Users who have worked with the 2200 apm will find the transition to the 2200 apm+ seamless, as all software options are available on both machines.Documents
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BESI / DATACON
2200 APM+
Verified
CATEGORY
Die Sorters & Attachers
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
75469
Wafer Sizes:
Unknown
Vintage:
Unknown
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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BESI / DATACON
2200 APM+
Verified
CATEGORY
Die Sorters & Attachers
Last Verified: Over 30 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
75469
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Fully Refurbished. Working Condition. Can build to spec.OEM Model Description
The 2200 apm+ is a die bonder from Datacon that is designed for advanced packaging with flip chip and die attach technologies. It can handle wafers of up to 300 mm and dies of up to 50 mm. The machine has a placement accuracy of 10µm@3s, making it suitable for handling the most demanding packages, including optoelectronic components. The 2200 apm+ is also capable of handling flip chip and die attach in one module, making it a versatile and flexible solution for advanced packaging. The machine is fully integrated into Datacon’s platform concept, allowing it to be combined with other line components such as stack loaders, Epoxy Writers, or the 2200 apm die bonder. This means that customers can tailor their production lines to their specific needs. The 2200 apm+ also has a range of accessories available, including wafer mapping, dispense units, gripper indexers, offline programming, and magazine handlers. Despite its advanced capabilities, the 2200 apm+ is operator-friendly and easy to use. Training times are short and reject rates are kept to a minimum. Users who have worked with the 2200 apm will find the transition to the 2200 apm+ seamless, as all software options are available on both machines.Documents
No documents
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