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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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MD-P200

Overview

MD-P200 is a device bonder for high-speed, high-quality bonding of bare ICs for cutting-edge devices. The basic structure comprises fixed-point pickup and mounting that supports supply of wafers up to ⌀200 mm. In response to innovations in manufacturing, such as multi-functionality, miniaturization and reduced thickness, and multi-layering, various functions such as flip-chip bonding, thermosonic bonding, DAF bonding, and stacked bonding, can also be selected. Assembly of high value-added devices such as RF modules, MEMS, power devices, and sensors. Die Bonder

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