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MUHLBAUER / MUEHLBAUER DS VARIATION ecoLINE
  • MUHLBAUER / MUEHLBAUER DS VARIATION ecoLINE
  • MUHLBAUER / MUEHLBAUER DS VARIATION ecoLINE
  • MUHLBAUER / MUEHLBAUER DS VARIATION ecoLINE
  • MUHLBAUER / MUEHLBAUER DS VARIATION ecoLINE
  • MUHLBAUER / MUEHLBAUER DS VARIATION ecoLINE
Description
No description
Configuration
Input: - 12’’ Wafer - Jedec-Tray (w/Adapter) Output: - 12’’ Wafer - 6’’ + 8’’ Wafer (w/Adapter) - Jedec-Tray (w/Adapter) Mapping: - Map-Host-PC w/Wafer-Mapping-Software, integrated Barcode-Readers Die Handling: - Single Bond Head - direct Pick & Place - Flip Chip w/integrated Endurance-Flip-Unit Place Accuracy: - Die-on fly: +/- 30my - Die-on-tool: +/- 20my - Rotation: +/- 1.5° Die Size: - Min.: 0.25 x 0.25 mm - Max. (flip): 20.0 x 20.0 mm - Max. (non-flip) 25.0 x 25.0 mm UPH: - Ø 4500   Machine Dimensions : - L x D x H : ~2550 x ~1950 x ~2000 mm - Weight : ~2300 kg AOI : - Die front side: - Die position using pattern matching or edge detection - Surface inspection - Die back side: - Die position using edge detection - Surface inspection - Sidewall inspection - Pre- & Post-Place inspection
OEM Model Description
Mühlbauer's overarching goal with the DS VARIATION ecoLINE is to significantly reduce the initial investment costs while at the same time ensuring maximum functionality in one platform. Accordingly, the DS VARIATION ecoLINE is characterized primarily by its cost-efficient design and its highly accurate AOI vision inspection capability. With the integrated high-precision mode for chip placement, a value of 20µm can be achieved. All standard inspection functions, especially top, back and side wall inspection, lead to a 100% six-sided inspection of the chips. Our latest IR inspection for sidewall and backside detection helps achieve even higher output quality. THE DS VARIATION ecoLINE can handle a whole range of niche applications such as T&R, de-taping, tray & waffle packs,
Documents
CATEGORY
Die Bonders / Sorters / Attachers

Last Verified: Over 30 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

106173


Wafer Sizes:

12"/300mm


Vintage:

2015


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

MUHLBAUER / MUEHLBAUER

DS VARIATION ecoLINE

verified-listing-icon
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 30 days ago
listing-photo-a8f4ede70cee4e06a52348a3b16bfe5e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/78462/a8f4ede70cee4e06a52348a3b16bfe5e/c773faa9e01d42acb63af82e63e164cb_img3906_mw.jpg
listing-photo-a8f4ede70cee4e06a52348a3b16bfe5e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/78462/a8f4ede70cee4e06a52348a3b16bfe5e/991ed763a3f341688ac7986a9dc16d96_img3905_mw.jpg
listing-photo-a8f4ede70cee4e06a52348a3b16bfe5e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/78462/a8f4ede70cee4e06a52348a3b16bfe5e/81d85433260e4037a13fa38ae8828fe8_img3908_mw.jpg
listing-photo-a8f4ede70cee4e06a52348a3b16bfe5e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/78462/a8f4ede70cee4e06a52348a3b16bfe5e/4e9afc991c9b4273a8ced59b515bfec2_img3907_mw.jpg
listing-photo-a8f4ede70cee4e06a52348a3b16bfe5e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/78462/a8f4ede70cee4e06a52348a3b16bfe5e/72cec9659b1647019c3400cb6af95883_img3909_mw.jpg
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

106173


Wafer Sizes:

12"/300mm


Vintage:

2015


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
Input: - 12’’ Wafer - Jedec-Tray (w/Adapter) Output: - 12’’ Wafer - 6’’ + 8’’ Wafer (w/Adapter) - Jedec-Tray (w/Adapter) Mapping: - Map-Host-PC w/Wafer-Mapping-Software, integrated Barcode-Readers Die Handling: - Single Bond Head - direct Pick & Place - Flip Chip w/integrated Endurance-Flip-Unit Place Accuracy: - Die-on fly: +/- 30my - Die-on-tool: +/- 20my - Rotation: +/- 1.5° Die Size: - Min.: 0.25 x 0.25 mm - Max. (flip): 20.0 x 20.0 mm - Max. (non-flip) 25.0 x 25.0 mm UPH: - Ø 4500   Machine Dimensions : - L x D x H : ~2550 x ~1950 x ~2000 mm - Weight : ~2300 kg AOI : - Die front side: - Die position using pattern matching or edge detection - Surface inspection - Die back side: - Die position using edge detection - Surface inspection - Sidewall inspection - Pre- & Post-Place inspection
OEM Model Description
Mühlbauer's overarching goal with the DS VARIATION ecoLINE is to significantly reduce the initial investment costs while at the same time ensuring maximum functionality in one platform. Accordingly, the DS VARIATION ecoLINE is characterized primarily by its cost-efficient design and its highly accurate AOI vision inspection capability. With the integrated high-precision mode for chip placement, a value of 20µm can be achieved. All standard inspection functions, especially top, back and side wall inspection, lead to a 100% six-sided inspection of the chips. Our latest IR inspection for sidewall and backside detection helps achieve even higher output quality. THE DS VARIATION ecoLINE can handle a whole range of niche applications such as T&R, de-taping, tray & waffle packs,
Documents