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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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DB-900

Overview

The DB-900 is equipped with a newly-designed high-speed bond head for the middle-end chip assembly market. This die bonder is designed to accommodate a 0.15mm pitch for miniature microchips and achieves a throughput of 18,000UPH(*) via a high-speed linear motor and paste application system.

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