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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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8800 TC

Overview

The Datacon 8800 TC is a bonding equipment that utilizes Thermo Compression (TC) technology, which is a crucial technology for current 2.5D/3D chip-to-substrate (C2S) and chip-to-wafer (C2W) packaging applications. Thermo Compression with CUF (Chip-to-Uneven-Flag) is a well-established process used in 3D memory applications. Die Bonder

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