BE Semiconductor Industries N.V. designs, develops, manufactures, markets and services die sorting, flip chip and multi-chip die bonding, packaging and plating equipment for the semiconductor industry's assembly operations.
Founded in 1968, Esec is a leading global manufacturer of die bonding equipment for the semiconductor, telecommunications and smart card industries based in Cham, Switzerland. It also manufactures and services wire bonding systems from its Singapore assembly facility.

BESI / ESEC

2008 xP

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Condition: Complete / No known issues
Status: Deinstalled

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Solidifying machine and laminating machine

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

2008 xP

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BESI / ESEC

2008 xP

BESI / ESEC

2008 xP

BESI / ESEC

2008 xP

BESI / ESEC

2008 xP

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BESI / ESEC

2008 xP

BESI / ESEC

2008 xP

BESI / ESEC

2008 xP