KLA-Tencor Corporation announced that it has completed its acquisition of the Microelectronic Inspection Equipment (MIE) business unit of Vistec Semiconductor Systems. 
Vistec Semiconductor Systems - MIE provides advanced semiconductor mask and wafer manufacturing systems. 

On February of 2006, Leica Microsystems' Semiconductor Equipment Division has a new name: Vistec Semiconductor Systems. The name change is a result Golden Gate Capital takeover of Leica's semiconductor business.

The INS3300 automated optical defect review and defect classification system incorporates UV and DUV optics for the highest resolution available on any optical review microscope. Fully automated and production-ready, the INS3300 defect classification system is user-friendly, ergonomic and reliable.

KLA / VISTEC / LEICA

INS3300

The Leica INS 3000 is the new defect review and inspection station. The all stainless-steel system features a fully automatic integrated microscope, including UV and Confocal, and universal wafer handler. The design priorities of the INS 3000 are ergonomy, cleanliness, automation and user-friendliness.The characteristics of the system are 1 to 3 cassette front loading, including SMIF, and a newly developed Windows™ NT based graphical user interface.

INS3000

INS2000

INS 10

INS3300 DUV

VB6-UHR EWF

The next-generation system, the LMS IPRO5, is designed to support the stringent precision and repeatability requirements for pattern placement metrology of reticles supporting advanced lithography techniques and 3Xnm to 2Xnm node devices.

LMS IPRO5

INS1000

 The LMS IPRO6 system  is used by mask shops for comprehensive characterization of reticle pattern placement error, which is a direct contributor to wafer-level pattern overlay error. The LMS IPRO6 utilizes model-based metrology to accurately measure reticle registration for on-device pattern features and standard registration marks, producing higher sampling for better determination of mask quality.

 LMS IPRO6

The INS3000 DUV is an automated optical defect review and classification system that combines the benefits of a conventional microscope with automation. It has a high resolution of up to 80nm, spanning visible, UV, and DUV wavelengths.

INS3000 DUV

Vistec’s LMS IPRO4 is a fully automated mask metrology system designed to support mask metrology requirements of the 45nm node. It can measure registration and critical dimensions in transmitted or reflected light at i-line (365nm). The system is known for its measurement performance, reliability, user-friendly interface, and comprehensive data evaluation software. It can also be equipped with an optional 300mm wafer chuck to qualify pattern placement of wafer lithography tools. Key features include I-line UV-illumination, edge detection, registration long-term repeatability, full coverage of 230mm reticles and 300mm wafers, through pellicle measurement capability, mask rotation capability, and enhanced minienvironment stability.

LMS IPRO4

The LMS IPRO3 is a high-performance pattern placement and CD metrology system designed for use with masks and wafers of up to 300mm in size. Its flexible feature edge detection, which uses image analysis, allows engineers to solve a variety of day-to-day problems, such as process control on non-orthogonal features. Additionally, the system’s flexible and comprehensive data analysis software provides valuable information on pattern generator, process quality, and product quality. This makes the LMS IPRO3 an essential tool for ensuring the highest levels of precision and accuracy in the manufacturing process.

LMS IPRO3

VB6-HR

The LMS IPRO7 reticle registration metrology system, introduced in September 2017, leverages a new operating mode to accurately measure on-device reticle pattern placement error with fast cycle time, enabling comprehensive reticle qualification for e-beam mask writer corrections and reduction of reticle-related contributions to device overlay errors in the IC fab.

KLA / VISTEC / LEICA

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INS3300

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