Overview

The FEI Expida 1285 offers the ultimate in defect characterization, failure analysis and TEM sample preparation on patterned and unpatterned wafers. With fast and accurate 3D defect characterization, you get increased control and improved yield. The Expida 1285 includes an integrated front-end module designed to simultaneously handle 200mm and 300mm wafers using load port modules in addition to all of the performance specification of the Expida 1255S.