Wafer size 100mm ~ 200mm
Flexible, Optimized Coating of MEMS with 3D Structures
In production processes for MEMS, SAW and power devices, there has been an increasing requirement for improved handling of pattern formation and material coating of devices with 3D structures. To meet these market needs, Screen has developed the 80EX spray coater. The versatile 80EX supports a wide variety of uses ranging from research and development to large-scale production.


SCREEN / SOKUDO

SC-80EX

SC-60EX

 The RF3T system features additional parallel process modules and higher efficiency wafer transport. The develop cell has been reconfigured for eight develop modules in the same platform footprint to provide 60% higher develop and rinse process capability than the previous system. A novel wafer coating dispense system significantly reduces chemical consumption, the largest contributor to track operating cost. Combined, these features provide lower CoO and higher process performance for lithography applications.

RF3T

RF3s

RF-300A

RF-310A is a cutting-edge solution combining high reliability and throughput for seamless process flows. Engineered with advanced technology for precision in finer pattern processing, its modular, flexible design ensures rapid delivery and assembly. Perfect for modern manufacturing needs.

RF-310A

SOKUDO DUO
High Productivity, >450 WPH Capable Dual Track System

SCREEN / SOKUDO

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SC-60EX

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RF3

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