Description
Issue with controller, for spare partsConfiguration
No ConfigurationOEM Model Description
"The ACS200Plus is a versatile spin coating and developing system designed for round wafers (2 inches to 200 mm) and square substrates (2 inches to 6 inches). It excels in various techniques like spin coating, spray coating, baking, and developing for applications including thin/thick adhesives and photosensitive polymers. It meets the demands of cutting-edge photoresist processes in optoelectronics, MEMS, and advanced packaging. With its modular design, the ACS200Plus offers flexibility for R&D, trial production, and mass production. Configurable with 2, 4, or 6 process modules around a central manipulator, it allows for scalability by adding additional modular units. The optional GYRSET module creates a uniform coating environment by minimizing disturbances and forming solvent-rich coatings. For a comprehensive lithography solution, the ACS200Plus can be combined with the MA200Compact mask alignment lithography machine to form the integrated LithoFab200 system."Documents
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SUSS MicroTec / KARL SUSS
ACS200 Plus
Verified
CATEGORY
Coaters & Developers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
102762
Wafer Sizes:
6"/150mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SUSS MicroTec / KARL SUSS
ACS200 Plus
CATEGORY
Coaters & Developers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
102762
Wafer Sizes:
6"/150mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Issue with controller, for spare partsConfiguration
No ConfigurationOEM Model Description
"The ACS200Plus is a versatile spin coating and developing system designed for round wafers (2 inches to 200 mm) and square substrates (2 inches to 6 inches). It excels in various techniques like spin coating, spray coating, baking, and developing for applications including thin/thick adhesives and photosensitive polymers. It meets the demands of cutting-edge photoresist processes in optoelectronics, MEMS, and advanced packaging. With its modular design, the ACS200Plus offers flexibility for R&D, trial production, and mass production. Configurable with 2, 4, or 6 process modules around a central manipulator, it allows for scalability by adding additional modular units. The optional GYRSET module creates a uniform coating environment by minimizing disturbances and forming solvent-rich coatings. For a comprehensive lithography solution, the ACS200Plus can be combined with the MA200Compact mask alignment lithography machine to form the integrated LithoFab200 system."Documents
No documents