Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

The Applied VeritySEM Metrology system offers industry-leading precision and high production throughput for CD-SEM measurements. It provides 3Å precision for 45nm gate and ArF resist features, meeting the requirements of 45nm device production. The system's high throughput, automation, and tool matching capabilities minimize the need for operators and reduce the number of CD-SEM tools per fab, resulting in increased productivity and reduced capital investment.

One of its latest features, OPC Check, automates the OPC mask qualification process, ensuring the accuracy of printed features on the wafer. The VeritySEM utilizes proprietary SEM technology with faster electron movement, creating a narrow beam and small spot size for high resolution and precise metrology. Advanced scanning methods and pattern recognition algorithms enable angstrom level precision. Flexible beam currents improve signal-to-noise ratio, enhancing pattern recognition and increasing throughput.
One of its latest features, OPC Check, automates the OPC mask qualification process, ensuring the accuracy of printed features on the wafer. The VeritySEM utilizes proprietary SEM technology with faster electron movement, creating a narrow beam and small spot size for high resolution and precise metrology. Advanced scanning methods and pattern recognition algorithms enable angstrom level precision. Flexible beam currents improve signal-to-noise ratio, enhancing pattern recognition and increasing throughput.One of the latest advances on VeritySEM is the OPC Check, the industry’s only solution to automate the OPC (Optical Proximity Correction) mask qualification process. As chipmakers advance into 65nm technology node and beyond, OPC-enhanced features are commonly incorporated into mask design of all layers. Hundreds of CD measurements are then required to verify that the features printed on the wafer are indeed what the device designers intended to produce. With a suite of proprietary algorithms, OPC Check gets input from EDA design systems, automatically creates CD-SEM measurement recipes, then direct VeritySEM to measure thousands of sites in high throughput without operator assistance.

With proprietary SEM technology, electrons in the VeritySEM column move 50% faster than before, creating a narrow beam and small spot size that resulted in high resolution and tight ArF metrology. Innovative scanning method and advanced pattern recognition algorithms built into the VeritySEM enable angstrom level precision. Flexible beam currents provide a better signal-to-noise ratio, enabling faster, more robust pattern recognition and, ultimately, increased throughput.

"For cost-conscious 300mm fab manufacturers, high precision and productivity are a winning combination," said Dr. Gilad Almogy, vice president and general manager of the Process Diagnostics and Control product business group. "Field tests of the VeritySEM consistently show high throughput in real production environments. Our customers are finding that almost 35% fewer VeritySEM tools are needed to achieve the same output than other CD-SEM tools. This translates into one-third less cost of ownership than any other CD-SEM tool on the market," adds Almogy.

"The Applied VeritySEM Metrology system offers industry-leading precision and high production throughput for CD-SEM measurements. It provides 3Å precision for 45nm gate and ArF resist features, meeting the requirements of 45nm device production. The system's high throughput, automation, and tool matching capabilities minimize the need for operators and reduce the number of CD-SEM tools per fab, resulting in increased productivity and reduced capital investment.

One of its latest features, OPC Check, automates the OPC mask qualification process, ensuring the accuracy of printed features on the wafer. The VeritySEM utilizes proprietary SEM technology with faster electron movement, creating a narrow beam and small spot size for high resolution and precise metrology. Advanced scanning methods and pattern recognition algorithms enable angstrom level precision. Flexible beam currents improve signal-to-noise ratio, enhancing pattern recognition and increasing throughput."

APPLIED MATERIALS (AMAT)

VeritySEM

CD-SEM

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APPLIED MATERIALS (AMAT)

VeritySEM

VeritySEM

CD-SEM

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APPLIED MATERIALS (AMAT)

VeritySEM