Overview

Synapse™ Z Plus, these systems are 300mm wafer bonder/debonder system which enable temporary bonding or debonding process efficiently. As the continuation of Moore’s law is becoming more and more challenging, 3D-IC with through-silicon via (TSV) interconnects secure a firm position in the field of advanced semiconductor, attracting attention as a means to improve semiconductor performance. Synapse™ Z Plus, equipped with wafer debonding, device and carrier wafer cleaning function, makes it possible to complete complicated wafer debonding process after TSV process with one system. The system has newly developed special function that provides stabilize transfer and safe process operation of ultra-thin wafers less than about 50um thickness.