We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. Read More
SYNAPSE S
Category
Bonder/DebonderOverview
Synapse™ S, a wafer fusion bonding equipment widely used in 300mm CMOS image sensor mass production lines. Original wafer bonder, built on the Lithius frame.
Active Listings
0
Services
Inspection, Insurance, Appraisal, Logistics
Top Listings
- No products found