Overview

The Ultra Dimension LV is an innovative solution combining Automated Optical Inspection, 2D Laser Via measurement and next generation Remote Multi-Image Verification (RMIV Pro) solution for laser vias. Powered by Orbotech’s Triple Vision Technology™, the Ultra Dimension LV is designed to meet the market’s constantly evolving requirements for quality and reliability in advanced PCB production, including SLP/ mSAP, advanced HDI, advanced flex and IC substrates.