Description
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The Expida 1255S, the first full wafer DualBeam to Include scanning transmission electron microscope (STEM) imaging capability, provides a complete solution for high resolution, high contrast STEM imaging, analysis, and sample preparation. As device sizes have continued to shrink, they have passed beyond the resolving power of scanning electron microscopy (SEM) and into the sub nanometer realm of STEM. However, the thin samples required by STEM impeded its acceptance in manufacturing applications until recent developments in focused ion beam (FIB) based techniques made sample preparation fast and reliable. Now the 1255S adds STEM Imaging to a 300 mm full wafer DualBeam to provide a complete solution, from wafer to results, In a single system, slashing time-to-answer for critical process information from days or weeks to hours.Documents
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THERMOFISHER SCIENTIFIC / FEI / PHILLIPS
EXPIDA 1255S
Verified
CATEGORY
Analytical
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
37941
Wafer Sizes:
Unknown
Vintage:
Unknown
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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THERMOFISHER SCIENTIFIC / FEI / PHILLIPS
EXPIDA 1255S
Verified
CATEGORY
Analytical
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
37941
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Expida 1255S, the first full wafer DualBeam to Include scanning transmission electron microscope (STEM) imaging capability, provides a complete solution for high resolution, high contrast STEM imaging, analysis, and sample preparation. As device sizes have continued to shrink, they have passed beyond the resolving power of scanning electron microscopy (SEM) and into the sub nanometer realm of STEM. However, the thin samples required by STEM impeded its acceptance in manufacturing applications until recent developments in focused ion beam (FIB) based techniques made sample preparation fast and reliable. Now the 1255S adds STEM Imaging to a 300 mm full wafer DualBeam to provide a complete solution, from wafer to results, In a single system, slashing time-to-answer for critical process information from days or weeks to hours.Documents
No documents