The MRC 603 is a sputter system designed to deposit thin film metals by DC source. It can hold four 6-inch wafers on a pallet for the process. The tool can be used to deposit aluminum (Al), titanium (Ti), and indium-tin-oxide (ITO) for single or multi-stack films like an Al/Ti

603 III

8667

8671 / 3A

902M

PLANAR

643P

924 PVD

8671

8800

903A

The MRC 693 is a sputtering system of the TES-600 Fast Cycle Load Lock variety that has undergone a complete rebuild by Technical Engineering Services (TES). It boasts updated software, a flat screen monitor from Planar, a Pinnacle II DC Power Supply from Advanced Energy, and control software and hardware from GE Fanuc System Automation. Additionally, it comes equipped with an RF Power Supply and a Matching Network.

8632

903WLL

903M

902A

603A-4

Load-locks for high throughput and come with a choice of two (Axis II), three (Axis III) and four (Axis IV) target configurations.



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