CANON acquired ANELVA and became CANON ANELVA Corporation which focuses on: Vacuum thin-film deposition and processing equipment, semiconductor device manufacturing equipment, storage device manufacturing equipment, equipment for electronic device manufacturing and for R&D, maintenance service, and vacuum components.


CANON / ANELVA

SPF-313H

L-430S-FHL

C-7500L

SPF-312

L-430S-FH

C-7960FL

L-332S-FH

ILC-1012

SPC-530H	

ILC 1051

SPL-500

C-7730FH

ILC-1013

System configuration: Cluster type (up to three annealing chambers) C to C type
Substrate size: φ3", φ4", φ6"

EC7200

The Anelva I-1060 SVII PLUS-1 is a sputter coating equipment that provides users with precise metal film deposition capabilities. This sputtering system is used to physically vaporize metal pellets, which can then be deposited onto a substrate through reactive ionization equipment

I-1060 SVII PLUS-1

I-1100 C 

Upgrade from HC7100 (PVD equipment for head) enabling mass-production of φ300 mm wafers based on experience with the φ300 mm wafer production line.

EC7800

HC7100 is a sputtering equipment for GMR heads and TMR heads that utilizes the tunnel effect.
System configuration: Cluster type
Substrate size: φ150mm、φ200mm

HC7100

System configuration: Cluster type
Substrate: Φ300 mm

NC7900

Effectively consolidates magnetic head production processes.This is an integrated magnetic HEAD production equipment only possible with Canon ANELVA product lineup.

System configuration: Cluster type
Substrate size: φ150mm, φ200mm

HC7300

EVC-1701

ML3000

IC7500

IC7200

System configuration: Tray cluster PVD equipment
Substrate size: φ2" substrate to φ8" substrate

EC8100

SPF-430H

System configuration: Cluster-type (EC7000 sputtering chamber ×1, EC7001 sputtering chamber ×2) Tray transport method
Substrate size: φ200mm maximum
Cathode: φ4" cathode ×3 (Option: φ12.5" cathode ×1, φ4" cathode ×4)
Operation method: Fully automated (pumping, transport, deposition)

EC7000

IC7400

EC7001

FC7100

System configuration: Load lock type tray transport method
Substrate size: φ200mm maximum
Cathode: φ4" cathode ×3 (Option: φ12.5" cathode ×1, φ4" cathode ×4)
Operation method: Fully automated (pumping, transport, deposition)

EB1100

The Anelva ILC-1015 is a sputtering system manufactured by Canon/Anelva. It is used for semiconductor processing assembly

ILC-1015

C-7010

The Anelva ILC-1060 is a specific model of a magnetron sputtering system. It features  features a vacuum chamber that provides a controlled environment for thin film deposition. The ILC-1060 can accommodate a variety of target materials, such as metals, alloys, or compounds, depending on the specific application requirements

ILC-1060

I-1060

System configuration: Tray transport method (Load lock is option)
Substrate size: φ150mm maximum (Have it of load lock;greatest φ100mm)
Cathode: φ2" cathode ×3
Operation method: Auto pumping operation, manual transport/deposit operation
Footprint: W1800mm×D1100mm×H1550mm (standard specification)

CANON / ANELVA

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Top CANON / ANELVA Sputter

SPF-313H

2 Listings

C-7500L

2 Listings

L-430S-FHL

2 Listings

SPL-500

1 Listings

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All CANON / ANELVA Sputter