Screen Semiconductor offers a variety of products throughout the semiconductor manufacturing processes: Screen offer tools for the following processes: Wafer cleaning system, measurement system, coat/develop track, inspection system, annealing system, and advanced packaging lithography.

Spectroscopic film thickness measurement systems (semi-automatic type).

SCREEN / DNS / DAINIPPON SCREEN

VL-M8000-S

Measurement systems – Spectroscopic film thickness measurement systems (embedded type)

VM-8000J-C

VM-3110

Wafer size 125mm ~ 300mm
Measurement Equipment to Support Electronic Devices for loT.
With the RE-3500, both film thickness and optical constants can be measured simultaneously. This unit is suitable for not only controlling film thickness, but also for processes in which film quality is crucial, as well as for developing new thin film materials and in the film creation process.

RE-3500

VM-201E

Measuring Equipment --Measuring Equipment --Optical Interference Film Thickness Measuring Systems (for FPD) Measurement systems – Spectroscopic film thickness measurement systems (for FPD)

STM-1603-P

Measurement systems – Spectroscopic film thickness measurement systems (manual type)

STM-602

Spectroscopic film thickness measurement systems (fully automatic type)

STM-651-ML

VL-M6000-FP

Measuring system – Spectroscopic film thickness measurement systems (semi-automatic type)

STM-602-JEX

Spectroscopic film thickness measurement systems (fully automatic type)


UV-M8100

VM-8000J-F

Measuring system - Spectroscopic film thickness measurement systems (fully automatic type).

VL-M8000-LS

STM-602-L

STM-603-P

VM-1000

VM-8000J

LAMBDA ACE VM-1200
A desktop model that can be incorporated into production lines.

VM-1200

Spectroscopic film thickness measurement systems (fully automatic type).

VL-M6000-LS

Measuring system – Spectroscopic film thickness measurement systems (fully automatic type)

VL-M8100

STM-603-PLS

UM-8200

Wafer size 100mm ~ 300mm
High-speed mode achieves a high throughput of 160 WPH, optimal for multipoint measurement of communications devices and other products. The VM-3500 can be optionally equipped with a trench measurement mechanism, enabling it to measure both film thickness and trench depth.

VM-3500

STM-602-PL

Measuring systems – Spectroscopic film thickness measurement systems (fully automatic type)

VM-3000

Measuring systems – Spectroscopic film thickness measurement systems (fully automatic type).


VM-2000

VM-300E

STM-602-PLS

UVM-6000

Spectroscopic film thickness measurement systems (manual type)

ST-M802J

STM-602-P

STM-602-PS

Measurement Systems-Spectroscopic trench measurement systems

SDM-603-PLS

SDM-601

STM-1601

UVM-8000

VM-200E

VLM-6000

LAMBDA ACE VM-3200
The VM-2200/3200 series offers high throughput of up to 160 wafers per hour in high-speed mode (during five-point measurement of SiO2 wafers).

VM-3200

LAMBDA ACE RE-3300 
The ellipsometer is not affected by warping or bending of wafers, enabling highly accurate measurements

RE-3300

Wafer size 100mm ~ 300mm
High-speed mode achieves a high throughput of 160 WPH, optimal for multipoint measurement of communications devices and other products.

VM-2500

VLM-6100

LAMBDA ACE VM-1030
Spectroscopic Film Thickness Measurement System
Microscope model that is ideal for R&D

VM-1030

LAMBDA ACE RE-3100
The ellipsometer is not affected by warping or bending of wafers, enabling highly accurate measurements.

RE-3100

Measuring Equipment --Measuring Equipment --Optical Interference Film Thickness Measuring Systems (for FPD) Measurement systems – Spectroscopic film thickness measurement systems (for FPD)


VL-M1800-S

SDM-601-PLS

ST-M602J

VL-M6000-S

STM-1601-P

LAMBDA ACE VM-1300
A desktop model that can be incorporated into production lines.

VM-1300

STM-803-PEX

Spectroscopic film thickness measurement systems (semi-automatic type)

STM-603-PS

VM-1100

VM-210E

SD-M803-PLS

STM-651-S

LAMBDA ACE VM-1020
Wafer size 50mm ~ 300mm
Microscope model that is ideal for R&D. 

VM-1020

STM-803-P

LAMBDA ACE VM-2200
The VM-2200/3200 series offers high throughput of up to 160 wafers per hour in high-speed mode (during five-point measurement of SiO2 wafers).

VM-2200

VM-2010

systems – Spectroscopic film thickness measurement systems (fully automatic type)

VM-8200

Measurement systems – Spectroscopic film thickness measurement systems (manual type)


VLM-8000

Measurement system – Spectroscopic film thickness measurement systems (embedded type)

SCREEN / DNS / DAINIPPON SCREEN

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STM-1603-P

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STM-602

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STM-651-ML

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VL-M6000-FP

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